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Journal Articles

Research of Underfill Delamination in Flip Chip by the J -Integral Method

Bulu Xu, Xia Cai, Weidong Huang, Zhaonian Cheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 94–99.
https://doi.org/10.1115/1.1648061
Published Online: April 30, 2004
...Bulu Xu; Xia Cai; Weidong Huang; Zhaonian Cheng Fracture mechanics approaches have been used to study reliability problems in electronic packages, in particular, adhesion related failure in flip chip assembly. It was verified in this work that the J-integral with a special flat rectangular contour...
View Article titled, Research of Underfill Delamination in Flip Chip by the <span class="search-highlight">J</span> -<span class="search-highlight">Integral</span> Method
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Topics: Delamination, Finite element analysis, Flip-chip, Flip-chip assemblies, Fracture (Materials), Simulation, Fracture mechanics, Flip-chip devices, Crack propagation, Cycles