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Journal Articles

Effect of Dispensing Type on Void Formation Using Convolutional Neural Network

Muhammad Taufik Azahari, Calvin Ling, Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011006.
Paper No: EP-23-1004
https://doi.org/10.1115/1.4065078
Published Online: August 9, 2024
... , A. , Zhu , M. , Zhmoginov , A. , and Chen , L. , 2018 , “ MobileNetV2: Inverted Residuals and Linear Bottlenecks ,” IEEE/CVF Conference on Computer Vision and Pattern Recognition , Salt Lake City, UT, June 18–23, pp. 4510 – 4520 . 10.1109/CVPR.2018.00474 [17] Ng , F. C. , Abas...
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Topics: Convolutional neural networks, Epoxy adhesives, Epoxy resins, Flip-chip devices, Flip-chip, Flow (Dynamics), Image processing