...Lihua Liang; Yuanxiang Zhang; Yong Liu Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. This paper presents atomic density redistribution algorithm for predicting electromigration induced...

...Hao Lu; Chun Yu; Peilin Li; Junmei Chen The current density distribution in a line-to-bump structure as a function of cross-sectional area ratio of the electrical conductor was investigated, as well as the effects of current crowding on electromigration and interfacial reaction in lead-free solder...

...: Sn - 4 Ag - 0.5 Cu , Sn - 3.5 Ag - 1 Cu , and Sn - 3 Ag - 1.5 Cu , subjected to two test conditions consisting of different average current densities and ambient temperatures ( 5 kA ∕ cm 2 at 150 ° C and 20 kA ∕ cm 2 at 30 ° C ). It is interesting to realize that as the Cu weight content...

...C. Basaran; H. Ye; D. C. Hopkins; D. Frear; J. K. Lin The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused by the combined effect of electromigration...