...-u.ac.jp 09 09 2021 21 12 2021 28 01 2022 conductive inks reliability flexible circuit direct write failure analysis KAKENHI Grant-in-Aid for Scientific Research (No. 19K04084) provided by the Japan Society for the Promotion of Science (JSPS) (Funder ID: 10.13039...

..., a failure analysis of Ag nanoparticle ink lines were assessed using current loading tests and microscopic observations to discuss the damage mechanism and evaluate electrical reliability under high-density current. Atomic transport due to EM was observed at 60 kA/cm 2 current loading, and relatively large...

... gives more consistent failure times. Failure analysis for the tested devices shows the primary failure mode is “input” trace crack first, followed by fatigue through the solder for complete failure. A finite element (FE) model, correlated with experimental modal analysis, is shown to accurately estimate...

.... As such, the stress had to be larger than in the real case and couple too much calculation noise inside. In the new model, the element-type solution was used to obtain a smooth distribution on the plot and prevent deviation. Failure analysis MEMS Microsystems Physics of failure Reliability Sensors...

... failure of solder joints under stress conditions [ 5 – 7 ]. Area array COB Failure analysis Flip chip Reliability Solder 28 01 2018 12 05 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING...

... manuscript received April 27, 2018; published online May 21, 2018. Assoc. Editor: Toru Ikeda. 12 10 2017 27 04 2018 Failure analysis Harsh environment Reliability Solder The fatigue failure of solder joints in printed circuit boards is one of the limiting factors...

... 20 03 2018 Electronic Failure analysis Harsh environment Ceramic packages are selected for microprocessors and similar components that support high-reliability electronics systems because they provide a hermetic environment that prevents the active device from being exposed...

... LECTRONIC P ACKAGING . Manuscript received September 28, 2017; final manuscript received January 4, 2018; published online March 2, 2018. Assoc. Editor: Sreekant Narumanchi. 28 09 2017 04 01 2018 Composite materials DCA Electronic Failure analysis Harsh environment Physics...

... Electronic Failure analysis Harsh environment Physics of failure Reliability The rapidly growing application fields in mobility, i.e., electromobility and automated driving (AD), and fully connected vehicles, not only trigger the development of a new generation of electronic systems...

... without overcooling the entire data center. Dynamic local cooling can be achieved by placing actuators to control cooling air delivery as close to the IT equipment as possible. Electronic Failure analysis Thermal analysis 18 09 2017 29 11 2017 Contributed by the Electronic...

..., all the test vehicles with fine pitch interconnects had fails at the aluminum/passivation layer interface at varied number of cycles ranging from 200 cycles to 1000 cycles. The extent of damage seen from cross-sectional failure analysis was qualitatively assessed based on visual inspection...

... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...

... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 26, 2015; final manuscript received March 1, 2017; published online June 14, 2017. Assoc. Editor: Jeffrey C. Suhling. 26 09 2015 01 03 2017 Composite materials COTS Failure analysis FR-4 Harsh...

...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...

... Annapragada. 26 12 2016 03 04 2017 Failure analysis Flexible circuits Reliability Stretchable electronics have a variety of possible applications and use conditions [ 1 – 8 ]. These applications will experience different mechanical boundary conditions in regards to mechanical...

... ACKAGING . Manuscript received December 16, 2016; final manuscript received March 24, 2017; published online April 24, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 24 03 2017 Electronic Failure analysis Harsh environment Physics of failure Reliability Thermal analysis...

... and silicon CMOS, so as to benefit from the afore described advantages offered by such an arrangement. Chip stacking Failure analysis Harsh environment Micro vias SOC Thermal analysis 14 06 2016 25 10 2016 Contributed by the Electronic and Photonic Packaging Division of ASME...

... . Manuscript received May 26, 2015; final manuscript received June 13, 2016; published online June 28, 2016. Assoc. Editor: Shi-Wei Ricky Lee. 26 05 2015 13 06 2016 3D packaging Chip stacking Failure analysis The three-dimensional integrated circuit (3D IC) is an emerging...

... 21 05 2016 22 05 2016 3D packaging CSP Failure analysis High density interconnects SMT List of JEP Reviewers Alekhya Addagatla David Hutt Kaustubh Nagarkar Dereje Agonafer Toru Ikeda Luu T. Nguyen S. Ravi Annapragada Toshitaka Ishizaki Mark...

... received February 15, 2016; published online March 23, 2016. Assoc. Editor: Yi-Shao Lai. 07 10 2015 15 02 2016 Failure analysis Power packaging Reliability Interconnection materials in electric devices undergo cyclic stress caused by a mismatch of thermal expansion...