...Muhammad Taufik Azahari; Calvin Ling; Aizat Abas; Fei Chong Ng Underfilling in flip chip packages is a critical component of reliability. This study utilized I-type, L-type, and U-type dispensing methods to address the issue, namely, voiding that creates empty spaces, which compromises reliability...

... Materials Symposium , Stone Mountain, GA , Mar. 3–6, pp. 201 – 209 . 10.1109/ISAPM.2002.990387 [2] Ng , F. C. , Abas , M. A. , and Abdullah , M. Z. , 2019 , “ Filling Efficiency of Flip-Chip Underfill Encapsulation Process ,” Solder. Surf. Mount Technol. , 32 ( 1 ), pp. 10...

..., 2018. Assoc. Editor: Xiaobing Luo. 28 02 2018 20 07 2018 Flip chip MEMS Microsystems Solder The ongoing technical progress, especially in electronics and its miniaturization, continuously poses new challenges for joining technologies. Examples are the joining...

... investigated the thermosonic flip chip bonding of a copper pillar with a tin cap. The effect of bonding force on bonding strength was studied, and an average bonding strength 2500 g (approximately 84.8 MPa) was obtained in 2 s, at an optimized bonding force of 0.11 N per 40 μ m pillar bump, and substrate...

... packaging Chip stacking Electrical design Flip chip Micro vias Reliability Thermal analysis Through-silicon via (TSV)-based three-dimensional (3D) integration presents a path toward reduced delay, reduced power consumption, higher performance, smaller packaging size, and heterogeneous...

... Advances and New Trends in Flip Chip Technology ,” ASME J. Electron. Packag. , 138 ( 3 ), p. 030802 . 10.1115/1.4034037 [3] He , Z. , Wei, L. , Shao, M. , and Lu, X. , 2017 , “ Detection of Micro Solder Balls Using Active Thermography and Probabilistic Neural Network ,” Infrared Phys...

...X. J. Yao; J. J. Fang; Wenjun Zhang The notion of permeability is very important in understanding and modeling the flow behavior of fluids in a special type of porous medium (i.e., the underfill flow in flip-chip packaging). This paper presents a new concept regarding permeability in a porous...

...Yasuo Takahashi; Hiroki Fukuda; Yasuhiro Yoneshima; Hideki Kitamura; Masakatsu Maeda Low-temperature microjoining, such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB), is necessary for electronics packaging. Each type of microjoining takes on various aspects...

...] Kim , S.-C. , and Kim , Y.-H. , 2013 , “ Review paper: Flip Chip Bonding With Anisotropic Conductive Film (ACF) and Nonconductive Adhesive (NCA) ,” Curr. Appl. Phys. , 13 ( Suppl. 2 ), pp. S14 – S25 . 10.1016/j.cap.2013.05.009 [3] Kim , Y. H. , Ma , S. W. , and Kim , Y.-H...

... on glass substrates. Fig. 10 Process flow of panel-level double-side assembly of 3D glass packages Surface acoustic wave filters were first assembled onto the substrates with a flip-chip bonder and mass reflowed at 260 °C. The assemblies were then underfilled by manual dispensing, followed...

... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...

... mode. Fig. 1 Schematic cross section of a flip-chip microelectronic package During manufacturing, in the assembly process, and end-user conditions, simulated by testing, these packages are exposed to high temperatures, thermal cycling, humidity, or a combination of these loads. These induce...

.... The most widely used methods are based on the standards set by Joint Electron Devices Engineering Council (JEDEC) [ 1 ]. Flip chip Wafer level packaging 30 06 2014 16 09 2015 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL...

.... Editor: Jeffrey C. Suhling. 03 11 2014 31 08 2015 3D packaging Bumping Failure analysis Flip chip Reliability Solder In recent years, 3D IC packaging has been in the attention of the researchers and industries due to several advantages over the traditional...

... nucleation flip chip fine pitch high I/O density no-flow underfill void formation Flip chip in package (FCIP) technology has been invented to meet the electrical and mechanical requirements of high performance devices in electronics packaging industry. Such capabilities enables it to be widely...

...Brett Fennell; Sangil Lee; Daniel F. Baldwin Conventional flip chip on board processing involves four major steps: flux application, solder reflow, underfill flow, and underfill cure. The latter two steps are particularly time consuming. To address this issue, a new flip chip process has been...

.... 239 – 250 . Kang , S. Y. , Williams , P. M. , and Lee , Y. C. , 1995 , “ Modeling and Experimental Studies on Thermosonic Flip-Chip Bonding ,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B 1070-9894 , 18 , pp. 728 – 733 . 10.1109/96.475282 Tan , Q...

...Sangil Lee; M. J. Yim; Daniel Baldwin This paper investigates the void formation mechanism induced by chemical interaction between eutectic solder (Sn63/Pb37) wetting and no-flow underfill material curing during flip chip in package assembly. During the process, low weight molecular components...

...Jin Yang; I. Charles Ume Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip scale packages, and ball grid arrays, use solder bump interconnections...

...S. B. Park; Rahul Joshi; Izhar Ahmed; Soonwan Chung Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). In PC, nonuniform temperature distribution...