... complicated process related to the dynamic process, involving electric, thermal, and mechanical. Hence, understanding the behaviors of IGBT under multiphysics fields coupling plays an important role in the design and reliability studies of IGBT. In this paper, we review the multiphysics coupling effects...

... a significant effect on the electrical performance and reliability of the ink. While others have numerically modeled the piezoresistive behavior of conductive polymers [ 16 – 19 ], they primarily focus on long conductive filler fibers or spherical fibers. In this work, two-dimensional (2D) platelets are used...

.... 103248 . 10.1016/j.mtcomm.2022.103248 [14] Hamasha , S. , Su , S. , Akkara , F. , Dawahdeh , A. , Borgesen , A. , and Qasaimeh , A. , 2017 , “ Solder Joint Reliability in Isothermal Varying Load Cycling ,” 16th IEEE ITHERM Conference , Orlando, FL, May...

... of flexible electronics, research is being conducted to better understand the failure mechanism of flexible electronics and thus improve their reliability and service life. In this paper, a cyclic mandrel bend test has been designed and carried out on printed conductors with PET and PI substrates...

... was evaluated by both solder ball shear and die shear tests. A high temperature storage test and humidity test were carried out to evaluate the solder joint reliability. Experiment results showed that the Ag pad fabricated by AM is compatible with surface mount technology (SMT). Reliable solder joints on the Ag...

... be detrimental to device reliability. Past studies have identified some failure mechanisms common to these devices. Examples of these failure mechanisms include fatigue, electromigration, stress induced voiding, corrosion, conduction filament formation, and time-dependent dielectric breakdown. While some review...

... wind under high-density current. Reducing the EM damage is extremely important to enhance the device reliability. With the progress in miniaturization of the metal nanoparticle ink lines, EM problem needs to be solved for ensuring the reliability of these lines. We know that the formation of aggregates...

...Xing Qiu; Jeffery C. C. Lo; Yuanjie Cheng; S. W. Ricky Lee; Yong Jhe Tseng; Peter Chiu Cu pillar microbumps with polymer cores have been demonstrated to effectively reduce thermomechanical stress and improve joint reliability. Fabricating polymer cores by a printing approach was proposed...

...Alex Davila-Frias; Shah Limon; Val Marinov; Om Prakash Yadav Predicting the reliability is an important task of product life cycle analysis, especially during the product development stages. The uncertainty in the operating conditions and the presence of multistress factors makes this reliability...

...Pradeep Lall; Jinesh Narangaparambil; Ben Leever; Scott Miller Additively printed flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the intended use. There is a dearth of standards for testing and reliability assurance of flexible...

..., and bicep curls were measured using a set of ten Vicon cameras to measure the position, velocity, and accelerations of a standard full-body sensor location of the human body. In addition, reliability data has been gathered on test vehicles subjected to dynamic flexing. Continuous resistance data have been...

...Minghong Jian; Sinan Su; Sa'd Hamasha; Mohammad M. Hamasha; Atif Alkhazali The reliability of solder joints plays a critical role in electronic assemblies. SnAgCu solder alloys with doped elements such as Bi and Sb is one of the candidates for high reliability applications. However, the mechanical...

... current has not been clarified. When electric devices are scaled down, current density and Joule heating increase in conductive lines and electromigration (EM) damage becomes a severe problem. Therefore, reducing the EM damage is extremely important to enhance the device reliability. In this study...

...Jinxin Liu; Zhiheng Huang; Paul P. Conway; Yang Liu Thermal stress-induced protrusions of copper through-silicon-vias (Cu-TSVs) during thermal processing pose substantial reliability concerns in three-dimensional (3D) system integration. In this study, a phase-field-crystal (PFC) model is used...

...Mahsa Montazeri; Cody J. Marbut; David Huitink In this work, a rapid and low-cost accelerated reliability test methodology which was designed to simulate mechanical stresses induced in flip–chip bonded devices during the thermal cycling reliability test under isothermal conditions, is introduced...

...; published online May 17, 2019. Assoc. Editor: Tse Eric Wong. 18 12 2018 27 03 2019 solder joint fatigue reliability stress strain creep The electronic packaging industry is one of the largest industries in the world [ 1 ]. The role of solder in the electronic packaging has...

... center operators. Many uncertainties and concerns persist regarding the effects of mineral oil immersion cooling on the reliability of information technology (IT) equipment both at the component and chassis level. This paper is a first attempt at addressing this challenge by reviewing the changes...

... in ease of applications. Cost, performance, reliability, and integration are concerns for technology implementation. The current study first discusses issues and status reported in literatures. Then it focuses on cost reduction and performance improvement of sintered silver using enhancement structures...

... to guarantee that all BGA devices meet the acceptance requirement of relevant standards. Generally, a large number of samples should be measured to obtain a relatively reliable warpage data distribution in the reflow temperature range, which makes this test quite costly and extremely time consuming. This study...

...Hamoon Azizsoltani; Achintya Haldar A novel reliability evaluation procedure of lead-free solders used in electronic packaging (EP) subjected to thermomechanical loading is proposed. A solder ball is represented by finite elements (FEs). Major sources of nonlinearities are incorporated...