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Keywords: time-to-failure
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031002.
Published Online: September 14, 2011
... of the existing studies on electromigration. The simulation results for void generation and time to failure (TTF) are discussed and correlated with the previous test results. EM sensitivity analysis is also performed to investigate the effect of EM parameters and mechanical properties of material...
