A method combining moire´ interferometry, Twyman–Green interferometry, and blind hole drilling method is proposed for simple and accurate determination of residual stress. The relationship between the three-dimensional surface displacements produced by introducing a blind hole and the corresponding residual stress is established by employing the Fourier expansion solution containing a set of undetermined coefficients. The coefficients are calibrated by 3D finite element method. The surface in-plane displacements and the out-of-plane displacement produced by the relaxation of residual stress are measured by moire´ interferometry and Twyman–Green interferometry, respectively, after the hole-drilling procedure. The complete three-dimensional displacement data at any single point around the hole can be used for residual stress determination. The accuracy of the method is analyzed and the experimental procedure is described to determine the sign of residual stresses. As an implementation of the method, a shot peening residual stress problem is studied. [S0094-4289(00)00802-1]
Study of Surface Residual Stress by Three-Dimensional Displacement Data at a Single Point in Hole Drilling Method
Contributed by the Materials Division for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY. Manuscript received by the Materials Division September 29, 1997; revised manuscript received October 14, 1999. Associate Technical Editor: Kwai S. Chan.
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Wu , Z., and Lu, J. (October 14, 1999). "Study of Surface Residual Stress by Three-Dimensional Displacement Data at a Single Point in Hole Drilling Method ." ASME. J. Eng. Mater. Technol. April 2000; 122(2): 215–220. https://doi.org/10.1115/1.482790
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