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Journal Articles

Effect of Dispensing Type on Void Formation Using Convolutional Neural Network

Muhammad Taufik Azahari, Calvin Ling, Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011006.
Paper No: EP-23-1004
https://doi.org/10.1115/1.4065078
Published Online: August 9, 2024
View Article titled, Effect of Dispensing Type on Void Formation Using Convolutional Neural Network
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Topics: Convolutional neural networks, Epoxy adhesives, Epoxy resins, Flip-chip devices, Flip-chip, Flow (Dynamics), Image processing
Journal Articles

Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning

Calvin Ling, Muhammad Taufik Azahari, Mohamad Aizat Abas, Fei Chong Ng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011001.
Paper No: EP-22-1076
https://doi.org/10.1115/1.4065077
Published Online: April 5, 2024
View Article titled, Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning
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Topics: Ball-Grid-Array packaging, Computer simulation, Machine learning, Pressure, Solders, Valves, Epoxy adhesives, Epoxy resins, Simulation, Temperature
Journal Articles

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041009.
Paper No: EP-21-1137
https://doi.org/10.1115/1.4052920
Published Online: December 1, 2021
View Article titled, Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package
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Topics: Design, Flip-chip packages, Flow (Dynamics), Optimization, Fluids, Computer simulation
Journal Articles

Underfill Flow in Flip-Chip Encapsulation Process: A Review

Fei Chong Ng, Mohamad Aizat Abas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010803.
Paper No: EP-21-1007
https://doi.org/10.1115/1.4050697
Published Online: August 6, 2021
View Article titled, Underfill Flow in Flip-Chip Encapsulation Process: A Review
Open the PDF for Underfill Flow in Flip-Chip Encapsulation Process: A Review in another window
Topics: Flow (Dynamics), Flip-chip, Fluids, Optimization, Design, Reliability
Journal Articles

Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation

Fei Chong Ng, Aizat Abas, M. Z. Abdullah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041009.
Paper No: EP-19-1066
https://doi.org/10.1115/1.4044817
Published Online: October 18, 2019
View Article titled, Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation
Open the PDF for Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation in another window
Topics: Flip-chip, Flow (Dynamics), Fluids, Pressure