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John R. Thome
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. December 2024, 16(12): 124501.
Paper No: TSEA-23-1377
Published Online: October 15, 2024
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041105.
Paper No: EP-24-1033
Published Online: July 25, 2024
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111848
Topics:
Cooling systems
Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111837
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97364
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
Published Online: November 22, 2021
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72620
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72621
Proceedings Papers
Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72612
Proceedings Papers
Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2541
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2542
Journal Articles
Mohamed M. Awad, Daniel Attinger, Adrian Bejan, Ali Beskok, Gian Piero Celata, Stéphane Colin, Vijay K. Dhir, Paolo Di Marco, Srinath V. Ekkad, Srinivas Garimella, Masahiro Kawaji, Michael R. King, Norbert Kockmann, Jon Kriegel, Sushanta K. Mitra, Saeed Moghaddam, Yuri S. Muzychka, Vinod Narayanan, Gherhardt Ribatski, S. A. Sherif, Masahiro Shoji, Peter Stephan, John R. Thome, Patricia B. Weisensee
Publisher: ASME
Article Type: Guest Editorial
J. Thermal Sci. Eng. Appl. December 2020, 12(6): 060301.
Paper No: TSEA-20-1603
Published Online: November 24, 2020
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6386
Journal Articles
Mohamed M. Awad, Sanjoy Banerjee, Vijay K. Dhir, Paolo Di Marco, Satish G. Kandlikar, Michael Kauffeld, Masahiro Shoji, John R. Thome
Publisher: ASME
Article Type: Guest Editorial
ASME J of Nuclear Rad Sci. January 2020, 6(1): 010303.
Paper No: NERS-19-1136
Published Online: November 29, 2019
Topics:
Engineering teachers
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
Published Online: March 2, 2018
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74020
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74030
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011005.
Paper No: EP-16-1083
Published Online: January 5, 2017
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010901.
Paper No: EP-15-1091
Published Online: March 10, 2016
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48288
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