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Proceedings Papers

Lamb Wave Inspection of Concrete Beams

Y. C. Jung, T. Kundu, M. Ehsani
Proc. ASME. IMECE99, On the Recent Advances of the Ultrasonic Nondestructive Evaluation and Composite Material Characterization, 33-46, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0886
https://doi.org/10.1115/IMECE1999-0886
View Paper titled, Lamb Wave Inspection of Concrete Beams
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Topics: Concrete beams, Inspection, Waves, Concretes, Electromagnetic scattering, Flaw detection, Flight, Fracture (Materials), Honeycomb structures, Longitudinal waves
Proceedings Papers

Elastic Wave Propagation in Circumferential Direction in Anisotropic Pipes

S. Towfighi, T. Kundu, M. Ehsani
Proc. ASME. IMECE2001, NDE Challenges of the 21st Century: Theory to Practice, 29-36, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/NDE-25803
https://doi.org/10.1115/IMECE2001/NDE-25803
View Paper titled, Elastic Wave Propagation in Circumferential Direction in Anisotropic Pipes
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Topics: Anisotropy, Elastic waves, Nondestructive evaluation, Pipes, Differential equations, Composite materials, Fibers, Fracture (Materials), Inspection, Modeling
Proceedings Papers

On the Formation of Photopolymerized Voxel With Varying Focal Length During Bulk Lithography

Kiran Bhole, Prasanna Gandhi, T. Kundu
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A035, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-38401
https://doi.org/10.1115/IMECE2014-38401
View Paper titled, On the Formation of Photopolymerized Voxel With Varying Focal Length During Bulk Lithography
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Topics: Lithography, Geometry, Hardening (Curing), Microfabrication, Resins, Simulation
Journal Articles

Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156)

M. Dube, T. Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Discussions
J. Electron. Packag. December 2011, 133(4): 045502.
https://doi.org/10.1115/1.4000902
Published Online: November 17, 2011
View Article titled, Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156)
Open the PDF for Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156) in another window
Topics: Electrons, Solders, Hardening
Journal Articles

Yield Function for Solder Elastoviscoplastic Modeling

M. Dube, T. Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 147–156.
https://doi.org/10.1115/1.1869514
Published Online: September 14, 2004
View Article titled, Yield Function for Solder Elastoviscoplastic Modeling
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Topics: Modeling, Solders, Temperature, Simulation, Stress
Journal Articles

Elastic Wave Propagation in Circumferential Direction in Anisotropic Cylindrical Curved Plates

S. Towfighi, T. Kundu, Fellow ASME, M. Ehsani
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. May 2002, 69(3): 283–291.
https://doi.org/10.1115/1.1464872
Published Online: May 3, 2002
View Article titled, Elastic Wave Propagation in Circumferential Direction in Anisotropic Cylindrical Curved Plates
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Topics: Anisotropy, Differential equations, Elastic waves, Fibers, Flat plates, Pipes, Plates (structures), Waves, Materials properties, Wave propagation
Journal Articles

Introductory Finite Element Method

CS Desai,, Author, T Kundu,, Author, Xiaoyan Lei,, Reviewer
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Book Reviews
Appl. Mech. Rev. January 2002, 55(1): B2.
https://doi.org/10.1115/1.1445303
Published Online: January 1, 2002
View Article titled, Introductory Finite Element Method
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Topics: Finite element analysis, Finite element methods
Journal Articles

Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application

C. Basaran, C. S. Desai, T. Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 48–53.
https://doi.org/10.1115/1.2792285
Published Online: March 1, 1998
View Article titled, Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application
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Topics: Electronic packaging, Finite element analysis, Thermomechanics, Alloys, Solders, Modeling, Surface mount technology
Journal Articles

Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation

C. Basaran, C. S. Desai, T. Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 41–47.
https://doi.org/10.1115/1.2792284
Published Online: March 1, 1998
View Article titled, Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation
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Topics: Electronic packaging, Finite element analysis, Thermomechanics, Constitutive equations, Cycles, Damage, Deformation, Design, Failure, Semiconductor devices
Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

C. S. Desai, J. Chia, T. Kundu, J. L. Prince
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 294–300.
https://doi.org/10.1115/1.2792252
Published Online: December 1, 1997
View Article titled, Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration
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Topics: Calibration, Constitutive equations, Electronic packaging, Thermomechanics, Failure, Creep, Damage, Design, Fatigue, Fatigue failure
Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design

C. S. Desai, J. Chia, T. Kundu, J. L. Prince
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 301–309.
https://doi.org/10.1115/1.2792253
Published Online: December 1, 1997
View Article titled, Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design
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Topics: Constitutive equations, Design, Electronic packaging, Thermomechanics, Failure, Fatigue, Fatigue failure, Modeling, Solders, Stress
Journal Articles

V ( z ) Curve Synthesis Using Two Ultrasonic Transducers

M. A. Awal, T. Kundu
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. June 1995, 62(2): 517–522.
https://doi.org/10.1115/1.2895960
Published Online: June 1, 1995
View Article titled, V ( z ) Curve Synthesis Using Two Ultrasonic Transducers
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Topics: Ultrasonic transducers, Acoustics, Microscopes, Fluids, Inspection, Plates (structures), Reflection, Theoretical analysis, Waves
Journal Articles

A Complete Acoustic Microscopical Analysis of Multilayered Specimens

T. Kundu
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. March 1992, 59(1): 54–60.
https://doi.org/10.1115/1.2899464
Published Online: March 1, 1992
View Article titled, A Complete Acoustic Microscopical Analysis of Multilayered Specimens
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Topics: Acoustics, Glass, Biological cells, Approximation, Biology, Cavities, Composite materials, Lenses (Optics), Materials science, Microscopes
Journal Articles

Dynamic Response of an Orthotropic Half-Space With a Subsurface Crack: In-Plane Case

M. R. Karim, T. Kundu
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. December 1991, 58(4): 988–995.
https://doi.org/10.1115/1.2897718
Published Online: December 1, 1991
View Article titled, Dynamic Response of an Orthotropic Half-Space With a Subsurface Crack: In-Plane Case
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Topics: Dynamic response, Fracture (Materials), Displacement, Elastic waves, Electromagnetic scattering, Integral equations, Polynomials, Radiation scattering, Scattering (Physics), Stress
Journal Articles

Axisymmetric Scattering of a Plane Longitudinal Wave by a Circular Crack in a Transversely Isotropic Solid

T. Kundu, A. Bostro¨m
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. September 1991, 58(3): 695–702.
https://doi.org/10.1115/1.2897250
Published Online: September 1, 1991
View Article titled, Axisymmetric Scattering of a Plane Longitudinal Wave by a Circular Crack in a Transversely Isotropic Solid
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Topics: Electromagnetic scattering, Fracture (Materials), Longitudinal waves, Radiation scattering, Scattering (Physics), Integral equations, Polynomials, Anisotropy, Boundary-value problems, Computation
Journal Articles

Detection of Delamination Cracks in Layered Fiber-Reinforced Composite Plates

M. R. Karim, T. Kundu, C. S. Desai
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research Papers
J. Pressure Vessel Technol. May 1989, 111(2): 165–171.
https://doi.org/10.1115/1.3265653
Published Online: May 1, 1989
View Article titled, Detection of Delamination Cracks in Layered Fiber-Reinforced Composite Plates
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Topics: Delamination, Fiber reinforced composites, Fracture (Materials), Plates (structures), Composite materials, Damage, Displacement, Dynamic response, Fast Fourier transforms, Integral equations
Journal Articles

Closure to “Discussion of ‘Transient Response of an Interface-Crack in a Layered Plate’” (1987, ASME J. Appl. Mech., 54, p. 245)

T. Kundu
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Discussions
J. Appl. Mech. March 1987, 54(1): 245.
https://doi.org/10.1115/1.3172978
Published Online: March 1, 1987
View Article titled, Closure to “Discussion of ‘Transient Response of an Interface-Crack in a Layered Plate’” (1987, ASME J. Appl. Mech., 54, p. 245)
Open the PDF for Closure to “Discussion of ‘Transient Response of an Interface-Crack in a Layered Plate’” (1987, ASME J. Appl. Mech., 54, p. 245) in another window
Topics: Fracture (Materials), Transients (Dynamics)
Journal Articles

Transient Response of an Interface-Crack in a Layered Plate

T. Kundu
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. September 1986, 53(3): 579–586.
https://doi.org/10.1115/1.3171814
Published Online: September 1, 1986
View Article titled, Transient Response of an Interface-Crack in a Layered Plate
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Topics: Fracture (Materials), Transients (Dynamics), FORTRAN, Space, Stress
Journal Articles

Diffraction of Elastic Waves by a Surface Crack on a Plate

T. Kundu, A. K. Mal
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. September 1981, 48(3): 570–576.
https://doi.org/10.1115/1.3157676
Published Online: September 1, 1981
View Article titled, Diffraction of Elastic Waves by a Surface Crack on a Plate
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Topics: Diffraction, Elastic waves, Surface cracks, Fracture (Materials), Waves, Deformation, Inspection, Plane strain, Rayleigh waves, Shear (Mechanics)