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Journal Articles

Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints

Whit Vinson, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011007.
Paper No: EP-24-1056
https://doi.org/10.1115/1.4066014
Published Online: August 9, 2024
View Article titled, Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
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Topics: Current density, Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Electrons
Proceedings Papers

Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing

Whit Vinson, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111909
https://doi.org/10.1115/IPACK2023-111909
View Paper titled, Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing
Open the PDF for Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing in another window
Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress